The U.S. government has controlled exports of high-bandwidth memory, HBM, a key semiconductor needed for artificial intelligence development, to China.
The U.S. Department of Commerce's Industrial Security Administration said in its official gazette that it is adding certain HBM products to items subject to export control to China.
HBM is a high-performance memory made by stacking several DRAMs, and SK Hynix, Samsung Electronics, and Micron are currently dominating the global market.
The Commerce Department has applied the rules of foreign direct products to the export control so that even products made in other countries will be included in the regulation if U.S. equipment and technology have been used.
The Commerce Department defined semiconductor export control standards as products with a "memory bandwidth density" of more than 2 gigabytes per second per square millimeter, the performance unit of HBM.
As a result, all HBMs currently produced have been included in the export control list.
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